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US 7,009,304 B2Granted
Resin-sealed semiconductor device
AssigneeRenesas Technology Corp.
InventorsKoji Bando, Hideki Ishii
Life of this patent
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Abstract
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
Claims5
A resin-sealed semiconductor device comprising:
- a first semiconductor chip having a circuit surface and a back surface opposing to each other;
- a die pad having a surface connected to said circuit surface of said first semiconductor chip;
- a second semiconductor chip having a circuit surface connected to said back surface of said first semiconductor chip, said second semiconductor chip having a back surface;
- wires for connecting each said circuit surface of said semiconductor chips to outer leads having inner ends;
- and
- a sealing resin for encapsulating said first semiconductor chip, said die pad, said other semiconductor chip and said wires so that the other surface of said die pad is exposed.
3 more elements
Dependencies are inferred from the claim text.