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US 7,009,293 B2Granted
Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device comprising a substrate. An interconnect pattern is formed over the substrate, and the substrate has a first portion and a second portion to be superposed on the first portion. The first portion has edges as positioning references. The second portion has a shape to be superposed over the first portion except the edges.
Claims10
A semiconductor device, comprising:
- a substrate having a first portion and a second portion overlapping with each other, the first portion including an end part as a positioning reference, the second portion having a shape which avoids being superposed over the end part of the first portion;
- a first semiconductor chip mounted on the first portion;
- and
- a second semiconductor chip mounted on the second portion, the second semiconductor chip adhering to at least a part of the first semiconductor chip,
- wherein the end part as the positioning reference includes two edges which are perpendicular to each other.
2 more elements
A semiconductor device, comprising:
- a substrate having a first portion and a second portion overlapping with each other, the first portion including an end part as a positioning reference, the second portion having a shape which avoids being superposed over the end part of the first portion;
- a first semiconductor chip mounted on the first portion;
- and
- a second semiconductor chip mounted on the second portion, the second semiconductor chip adhering to at least a part of the first semiconductor chip,
- wherein the first portion comprises a rectangular body section and a projected section which extends from at least one edge of the body section and includes the end part.
2 more elements
A semiconductor device, comprising:
- a substrate having a first portion and a second portion overlapping with each other, the first portion including an end part as a positioning reference, the second portion having a shape which avoids being superposed over the end part of the first portion;
- a first semiconductor chip mounted on the first portion;
- and
- a second semiconductor chip mounted on the second portion, the second semiconductor chip adhering to at least a part of the first semiconductor chip,
- wherein a plurality of holes are formed in the end parts.
2 more elements
A semiconductor device, comprising:
- a substrate having a first portion and a second portion overlapping with each other, the first portion including an end part as a positioning reference, the second portion having a shape which avoids being superposed over the end part of the first portion;
- a first semiconductor chip mounted on the first portion;
- and
- a second semiconductor chip mounted on the second portion, the second semiconductor chip adhering to at least a part of the first semiconductor chip,
- wherein the second portion is separated from the first portion;
- and
- wherein the first and second portions are connected by the interconnect.
4 more elements
Dependencies are inferred from the claim text.