Optoelectronic semiconductor component

An optoelectronic semiconductor component, comprising:

• a lead frame having a chip carrier, and an independent link-part, said chip carrier formed with a central position mark thereon and defined as an inner electrical contact, said central position mark being shaped as a “+”, said independent link-part being another inner electrical contact;
• a semiconductor chip secured on said chip carrier, said semiconductor chip electrically connected with said chip carrier and said independent link-part;
• an encapsulation body having an inner surface, said inner surface encircling a part of said chip carrier and said independent link-part to define an annular ellipsoid;
• an optical window part formed in a concave portion of said annular ellipsoid;
• and
• a pair of outside connecting parts respectively extending from said chip carrier and said independent link-part and exposed by said encapsulation body as outer contacts.

An optoelectronic semiconductor component, comprising:

• a lead frame having a chip carrier, and an independent link-part, said chip carrier formed with a central position mark thereon and defined as an inner electrical contact, said independent link-part being another inner electrical contact;
• a semiconductor chip secured on said chip carrier, said semiconductor chip electrically connected with said chip carrier and said independent link-part;
• an encapsulation body having an inner surface, said inner surface encircling a part of said chip carrier and said independent link-part to define an annular ellipsoid;
• an optical window part formed in a concave portion of said annular ellipsoid;
• a pair of outside connecting parts respectively extending from said chip carrier and said independent link-part and exposed by said encapsulation body as outer contacts;
• and
• a pair of fixing portions extending outwardly from two sides of said encapsulation body, each fixing portion having a horizontal portion parallel to an emission direction, wherein said outside connecting parts are formed on a bottom of the horizontal portions of the fixing portions, the optoelectronic semiconductor component being thereby soldered onto a PCB parallel to an emission direction.