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US 7,009,281 B2Granted
Small volume process chamber with hot inner surfaces
AssigneeLam Inc.
InventorsAndrew D. Bailey, III, Tuqiang Ni
Life of this patent
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Abstract
A system and method of processing a substrate including loading a substrate into a plasma chamber and setting a pressure of the plasma chamber to a pre-determined pressure set point. Several inner surfaces that define a plasma zone are heated to a processing temperature of greater than about 200 degrees C. A process gas is injected into the plasma zone to form a plasma and the substrate is processed.
Claims7
A small volume plasma chamber comprising:
- a first electrode, the first electrode forming a chuck for supporting a substrate;
- a second electrode, the second electrode being deposed substantially parallel to the first electrode, the first electrode and second electrode being separated by a predetermined distance;
- and
- a hot liner, wherein the hot liner and the second electrode form a portion of a plurality of inner surfaces to define a plasma zone, the hot liner having a temperature sufficient to substantially prevent deposition on the hot liner.
1 more element
Dependencies are inferred from the claim text.