Method of building a CMOS structure on thin SOI with source/drain electrodes formed by in situ doped selective amorphous silicon

A CMOS structure comprising:

• a PFET transistor and a NFET transistor, each of said PFET and NFET transistors including
• a raised source/drain (RSD) structure;
• a channel region;
• a gate region of a substrate sufficient for silicidation of contacts;
• a gate structure at said gate region;
• a PFET boron doped region and NFET boron doped region and a PFET arsenic doped region and a NFET doped arsenic region, said PFET arsenic doped region having a portion extending between said PFET boron doped region and said channel of said PFET transistor and said NFET boron doped region having a portion extending between said NFET arsenic doped region and said channel of said NFET transistor, said NFET arsenic doped region and said PFET boron doped region extending to a surface of said gate structure, defining respective source/drain junctions adjacent respective said gate regions, wherein the NFET boron doped region overlaps the gate region of said NFET transistor and said NFET arsenic doped region overlaps the gate region of said NFET transistor;
• said PFET boron doped region being contained within said PFET arsenic doped region, wherein the PFET boron doped region does not overlap said gate region of said PFET transistor;
• said NFET arsenic doped region being implanted adjacent the gate region of said NFET transistor;
• and
• permanent dual spacers at said source/drain junctions.