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US 7,009,163 B2Granted
High-sensitivity optical scanning using memory integration
AssigneeOrbotech Ltd.
InventorsYigal Katzir, Itay Gur-Arie, Yacov Malinovich
Life of this patent
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Abstract
An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.
Claims48
An inspection system comprising:
- a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing a plurality of two-dimensional outputs representing an object to be inspected, said plurality of outputs including at least a first image frame and a second image frame, said first image frame obtained by simultaneous detection of a two dimensional portion of said object by a plurality of lines of said array of photosensors and said second image frame subsequently obtained by simultaneous detection of a two dimensional portion of said object by a plurality of lines of said array of photosensors;
- and
- a defect analyzer utilizing said plurality of outputs to detect defects in said object.
A method for manufacturing electrical circuits comprising:
- depositing a portion of an electrical circuit on a substrate in a given pattern;
- and
- optically inspecting said portion to determine defects in said portion using an inspection system comprising:
- a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing a plurality of two-dimensional outputs representing an electrical circuit to be inspected, said plurality of outputs including at least a first image frame and a second image frame, said first image frame obtained by simultaneous detection of a two dimensional portion of said electrical circuit by a plurality of lines of said array of photosensors and said second image frame subsequently obtained by simultaneous detection of a two dimensional portion of said object by a plurality of lines of said array of photosensors;
- and
- a defect analyzer utilizing said plurality of outputs to detect defects in said electrical circuit.
3 more elements
Dependencies are inferred from the claim text.