System and method for joining flat flexible cables
AssigneeVisteon Global Technologies, Inc.
InventorsZhong-You (Joe) Shi, Peter J. Sinkunas
Life of this patent
Estimating the term…
Abstract
A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.
Claims18
A method for interconnecting flat cable, the flat cable having a plurality of conductors attached to an insulating layer, the method comprising:
- removing the insulation layer from first and second flat cable portions to expose the plurality of conductors;
- applying a thermal plate to the exposed plurality of conductors of the first flat cable portion;
- applying solder to first flat cable portion;
- placing the plurality of conductors of the second flat cable portion in contact with the plurality of conductors of first flat cable portion having the applied solder;
- positioning a transparent plate over the conductors of first and second flat cable portions;
- and
- scanning a laser beam over and through the transparent plate to reflow the solder between the first and second flat cable portions, wherein an electrical interconnection between the first and second flat cable portions is formed.
A system for interconnecting flat cable, the flat cable having a plurality of conductors attached to an insulating layer and wherein the insulation layer is removed from first and second flat cable portions to expose the plurality of conductors, the system comprising:
- a thermal plate applied to a first side of the exposed plurality of conductors of the first flat cable portion;
- a solder applied to a second side of the exposed plurality of conductors of the first flat cable portion, wherein the plurality of conductors of the second flat cable portion is placed in contact with the plurality of conductors of first flat cable portion having the applied solder;
- a transparent plate positioned over the plurality of conductors of first and second flat cable portions;
- and
- a laser beam for scanning across and through the transparent plate to reflow the solder between the first and second flat cable portions to form an electrical interconnection between the first and second flat cable portions.
Dependencies are inferred from the claim text.