A contact device for contacting one or more power electronic components having strip conductors arranged on a substrate, said contact device comprising at least one flat contact element being adapted to electrically connect a contact surface on a component to one of the strip conductors, said contact device's individual contact elements being connected to each other by bridges adapted to be severed by means of at least one of laser cutting, electron beam cutting, and ion beam cutting, and wherein at least one contact element for a control contact is arranged in a recess of a contact element for a power contact and is connected with this by means of at least one bridge.