Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities
AssigneeOSRAM GmbH
InventorsKlaus Höhn, Günter Waitl, Karlheinz Arndt
Life of this patent
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Abstract
A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.
Claims13
A transparent casting resin compound for casting out optoelectronic components on the basis of an acid anhydride-curable epoxy compound, said compound comprising:
- a mixture of an A-component and a B-component in a weight ratio in a range of 100:100 through 100:80, said resin compound having a viscosity at 25° C. of less than 3000 mPas and having a glass transition temperature of the shaped material resulting therefrom of above 130° C.
- said A-component comprising a mixture of a diglycidyl ether of bisphenol-A, with the prescription that cycloaliphatic epoxy compounds are excluded, and one epoxy novolak resin as a multi-functional epoxy with a proportion of 20–50 weight % in the A-component as the only epoxy components of the A-component;
- and
- said B-component comprising a zinc salt accelerator and containing a hexahydrophthalic acid anhydride as the acid anhydride.
A method for utilizing a transparent casting resin compound for encapsulating, covering or enveloping a device comprising:
- providing the device;
- preparing the transparent casting resin compound comprising a mixture of an A-component, a B-component and additives, in a weight ratio in a range of 100:100 to 100:80, said compound having a viscosity of less than 3000 mPas at 25° C. and having a glass transition temperature in a cured state above 130° C. said A-component comprising a mixture of a diglycidyl ether of bisphenol-A with all cycloaliphatic epoxy compounds being excluded, and one epoxy novolak resin as a multi-functional epoxy with a proportion of 20–50 weight % as the only epoxy components in the A-component, and the B-component comprising a zinc salt accelerator and hexahydrophthalic acid anhydride;
- and
- coating at least a part of the device.
Dependencies are inferred from the claim text.