Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof
AssigneeIndustrial Technology Reserarch Institute
InventorsShur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yi-Kai Chang, Jinn-Shing King
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Abstract
The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
Claims18
An organic-inorganic hybrid composition, which comprises:
- a) a high Tg epoxy resin system comprising an epoxy resin with the following structure:
- wherein n is 0–10;
- and
- b) ferroelectric ceramic particles having two or more particle size distributions, wherein a first particle size distribution is 1–100 nm, and a second particle size distribution is 300 nm–5 μm.
Dependencies are inferred from the claim text.