Loading patent…
AssigneeZeon Corporation
InventorsMotofumi Kashiwagi, Noriyuki Mitao
Estimating the term…
A photoresist composition comprising (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component and an organic solvent; an insulation film for organic EL devices which is formed by heating a resist film formed with the composition on a substrate in accordance with photolithography, has a sectional shape having upper edge portions having a round shape and the width increasing towards the bottom portion and has a thickness is in the range of 0.3 to 3 μm; and a process for producing the insulation film using the photoresist composition. The photoresist composition, the insulation film for organic EL devices and the process for producing the insulation film provide an insulation film having a sectional shape advantageous for an insulation film for organic EL devices since the width in the sectional shape of the film increases towards the bottom portion.
A photoresist composition for forming an insulation film for organic electroluminescence devices which comprises (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component which is curable at a temperature higher than a temperature of heat resistance of a resist film formed with the composition in accordance with photolithography, and an organic solvent, wherein the thermosetting component (C) is an imide resin.
An insulation film for organic electroluminescence devices which is formed by heating a resist film having a desired pattern and formed with a composition which comprises (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component which is curable at a temperature higher than a temperature of heat resistance of a resist film formed with the composition in accordance with photolithography, and an organic solvent, on a substrate in accordance with photolithography, has a sectional shape having upper edge portions having a round shape and a width increasing towards a bottom portion and has a thickness in a range of 0.3 to 3 μm.
A process for producing an insulation film for organic electroluminescence devices, the process comprising forming a resist film using a photoresist composition comprising (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component that is an imide resin and which is curable at a temperature higher than a temperature of heat resistance of a resist film formed with the composition in accordance with photolithography, and an organic solvent on a substrate in accordance with photolithography and heating the formed resist film at a temperature higher than a temperature of heat resistance of the resist film so that the thermosetting component in the resist film is cured.
Dependencies are inferred from the claim text.