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US 7,008,855 B2Granted
Glass frit bond and process therefor
AssigneeDelphi Technologies, Inc.
InventorsWilliam J. Baney, Brenda B. Baney, Heather Hude
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Abstract
A lead-containing glass material of the type suitable for use in a wafer bonding process, wherein the moisture resistance of the glass material is increased by the presence of a lead phosphate coating on an outer exposed surface of the material, thereby acting as a barrier to reaction of moisture with the lead of the glass material. A source of reactive phosphate ions is applied to the glass material so as to spontaneously form the desired lead phosphate coating.
Claims19
A method comprising the steps of:
- depositing a lead-containing glass frit material on a surface, the glass frit material comprising glass frit particles;
- firing the glass frit material to melt and fuse the particles and form a glass bond;
- and then
- applying a source of reactive phosphate ions to the glass bond so as to form a lead phosphate coating on the glass bond.
1 more element
A method of bonding a device wafer to a capping wafer, the method comprising the steps of:
- depositing a glass frit material on a surface of one of the device and capping wafers, the glass frit material comprising glass frit particles, at least some of the particles being formed of a lead oxide;
- firing the glass frit material to melt and fuse the particles and form a glass bond that bonds the device wafer to the capping wafer;
- and then
- applying a solution containing a source of reactive phosphate ions to the glass bond so as to spontaneously form a lead phosphate coating on the glass bond.
1 more element
Dependencies are inferred from the claim text.