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US 7,008,824 B2Granted
Method of fabricating mounted multiple semiconductor dies in a package
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The first die, second die, and leadframe are encapsulated in a package.
Claims9
A method for mounting multiple semiconductor dies on a single leadframe having fingers, comprising:
- stacking at least two semiconductor dies having substantially the same rectangular dimensions on top of one another such that one of said dies is mounted on top of the leadframe fingers and the other of said dies is mounted on and in contact with the die mounted on the leadframe fingers, both of said dies being on the same side of said leadframe fingers;
- and
- wirebonding each of said semiconductor dies to the same leadframe fingers.
A method of connecting multiple semiconductor dies having bonding pads and a single leadframe having fingers, comprising:
- locating a first semiconductor die on the leadframe fingers of the leadframe;
- stacking a second semiconductor die on said first semiconductor die and in contact with said first semiconductor die and on the same side of said lead fingers as said first semiconductor die;
- and
- electrically connecting the bonding pads of the semiconductor dies to the same lead fingers of the leadframe.
1 more element
A method for mounting multiple semiconductor dies on a single leadframe having fingers with first and second sides, comprising:
- stacking first and second semiconductor dies having substantially the same rectangular dimensions on top of and in contact with one another;
- mounting the first semiconductor die on said first side of said a leadframe fingers;
- mounting the second semiconductor die on the first side of said leadframe;
- mounting said semiconductor die directly on said first semiconductor die;
- and
- wirebonding the first and second semiconductor dies to the same lead fingers of the leadframe.
3 more elements
Dependencies are inferred from the claim text.