Method for fabricating semiconductor component having stacked, encapsulated dice

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of first interconnect contacts and a plurality of second interconnect contacts;
• adhesively bonding a first die to the substrate;
• electrically connecting the first die to the first interconnect contacts;
• encapsulating the first die and the first interconnect contacts in a first encapsulant having a planar surface on the first die and at least one molded feature on the planar surface configured to facilitate bonding to the first encapsulant;
• adhesively bonding a second die to the planar surface and to the molded feature;
• electrically connecting the second die to the second interconnect contacts;
• and
• encapsulating the second die, the first encapsulant, and the second interconnect contacts in a second encapsulant.

A method for fabricating a semiconductor component comprising:

• providing a substrate on a leadframe comprising a plurality of first interconnect contacts and a plurality of second interconnect contacts;
• back bonding a first die to the substrate comprising a circuit side, a plurality of first die contacts on the circuit side, and a back side;
• bonding a plurality of first interconnects to the first die contacts and to the first interconnect contacts;
• encapsulating the first die and the first interconnects in a first encapsulant having a planar surface on the circuit side;
• back bonding a second die to the planar surface of the first encapsulant comprising a plurality of second die contacts;
• bonding a plurality of second interconnects to the second die contacts and to the second interconnect contacts;
• encapsulating the second die, the second interconnects and the first encapsulant in a second encapsulant;
• and
• singulating the substrate from the leadframe such that the second encapsulant and the substrate have a matching peripheral outline.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of interconnect contacts and a plurality of terminal contacts in electrical communication with the interconnect contacts;
• forming a plurality of die stacks on the substrate, each die stack comprising a first die bonded to the substrate in electrical communication with the interconnect contacts, a first encapsulant encapsulating the first die comprising a planar surface on the first die and at least one feature on the planar surface configured to facilitate bonding to the first encapsulant, and a second die bonded to the first encapsulant in electrical communication with the interconnect contacts;
• and
• forming a second encapsulant on the substrate encapsulating the die stacks;
• the forming the die stacks step comprising wire bonding the first die and the second die to the interconnect contacts.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of interconnect contacts and a plurality of terminal contacts in electrical communication with the interconnect contacts;
• forming a plurality of die stacks on the substrate, each die stack comprising a first die bonded to the substrate in electrical communication with the interconnect contacts, a first encapsulant encapsulating the first die comprising a planar surface on the first die and at least one feature on the planar surface configured to facilitate bonding to the first encapsulant, and a second die bonded to the first encapsulant in electrical communication with the interconnect contacts;
• and
• forming a second encapsulant on the substrate encapsulating the die stacks;
• the forming the die stacks step comprising TAB bonding the first die and the second die to the interconnect contacts.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of interconnect contacts and a plurality of terminal contacts in electrical communication with the interconnect contacts;
• forming a plurality of die stacks on the substrate, each die stack comprising a first die bonded to the substrate in electrical communication with the interconnect contacts, a first encapsulant encapsulating the first die comprising a planar surface on the first die and at least one feature on the planar surface configured to facilitate bonding to the first encapsulant, and a second die bonded to the first encapsulant in electrical communication with the interconnect contacts;
• and
• forming a second encapsulant on the substrate encapsulating the die stacks;
• the forming the die stacks step comprising transfer molding the first encapsulant with a direct gate mold cavity configured to not contaminate selected interconnect contacts.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of interconnect contacts and a plurality of terminal contacts in electrical communication with the interconnect contacts;
• back bonding a first die to the substrate;
• electrically bonding the first die to the interconnect contacts;
• encapsulating the first die in a first encapsulant;
• back bonding a second die to the first encapsulant, the first encapsulant comprising at least one feature configured to facilitate bonding of the second die to the first encapsulant;
• electrically bonding the second die to the interconnect contacts;
• encapsulating the second die in a second encapsulant;
• back bonding a third die to the second encapsulant;
• electrically bonding the third die to the interconnect contacts;
• and
• encapsulating the third die and the second encapsulant in a third encapsulant.