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US 7,008,819 B2Granted
Method of fabricating an array of wafer scale polymeric caps
AssigneeSilverbrook Research Pty Ltd
InventorKia Silverbrook
Life of this patent
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Abstract
A method of fabricating an array of wafer scale polymeric caps is provided. The method includes forming, in a two part mold, a plurality of first hollow molded caps from a layer of thermoplastic material which is placed in the mold. The mold has first and second mold halves which are brought together to form the caps. The first hollow molded caps are subsequently separated into an array of individual caps.
Claims20
A method of fabricating an array of wafer scale polymeric caps, the method including:
- forming, in a two part mold, a plurality of first hollow molded caps from a layer of thermoplastic material which is placed in the mold, the mold having first and second mold halves which are brought together to form the caps;
- and
- separating the plurality of first hollow molded caps into an array of individual caps.
Dependencies are inferred from the claim text.