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US 7,008,818 B2Granted
Flip chip packaging process employing improved probe tip design
AssigneeUnited Microelectronics Corp.
InventorsHung-Min Liu, Kow-Bao Chen
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Abstract
The present invention provides a novel probe tip suited for flip-chip packaging process. The probe tip comprises a needle body; and a stop cylinder having a recess for fittingly accommodating the needle body therein, the needle body being electrically connected to the stop cylinder via a resilient conductive material. The stop cylinder has an annual flat bottom surrounding the needle body for pressing a protruding probe mark on a metal pad scratched by the needle body.
Claims8
A flip-chip packaging process comprising:
- providing a chip having thereon at least one metal pad surface;
- providing a probe tip comprising a needle body and a stop cylinder having a recess for accommodating the needle body therein, the needle body being electrically connected to the stop cylinder via a resilient conductive material;
- laterally moving the needle body of the probe tip to scratch a portion of the metal pad surface so as to form a protruding probe mark thereon;
- pressing the protruding probe mark to a predetermined height with the stop cylinder;
- forming a under bump metallurgy (UBM) over the metal pad surface;
- and
- forming a bump over the UBM.
4 more elements
Dependencies are inferred from the claim text.