Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate
AssigneeSeiko Epson Corporation
InventorHironori Hasei
Life of this patent
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Abstract
A pattern formation method for forming a film pattern upon a substrate, including the steps of: forming banks in a predetermined pattern upon the substrate; disposing liquid drops of a functional liquid at the end portions of groove portions which are defined between the banks; and after having disposed the drops at the end portions of the groove portions, disposing liquid drops in positions of the groove portions other than the end portions thereof.
Claims21
A pattern formation method for forming a film pattern upon a substrate, comprising the steps of:
- forming banks in a predetermined pattern upon said substrate;
- disposing liquid drops of a functional liquid at end portions of groove portions which are defined between said banks;
- and
- after having disposed said drops at said end portions of said groove portions, disposing liquid drops in positions of said groove portions other than said end portions thereof.
A pattern formation method for forming a film pattern upon a substrate, comprising the steps of:
- providing a liquid repelling layer in a region which surrounds a pattern formation region upon said substrate in which a predetermined pattern is to be formed;
- disposing liquid drops of a functional liquid at end portions of said pattern formation region;
- and
- after having disposed said drops at said end portions, disposing liquid drops at positions of said pattern formation region other than said end portions thereof.
A method for manufacturing an active matrix substrate, comprising:
- a first step of forming a gate lead line upon a substrate;
- a second step of forming a gate insulation layer over said gate lead line;
- a third step of forming a semiconductor layer over said gate insulation layer;
- a fourth step of forming a source electrode and a drain electrode over said gate insulation layer;
- a fifth step of disposing an insulation material over said source electrode and said drain electrode;
- and
- a sixth step of forming a pixel electrode which is electrically connected to said drain electrode;
- wherein at least one of said first step, said fourth step, and said sixth step comprises the steps of:
- forming banks corresponding to a predetermined pattern upon said active matrix substrate;
- disposing liquid drops at end portions of groove portions which are defined between said banks;
- and
- after having disposed said liquid drops at said end portions of said groove portions, disposing liquid drops in positions of said groove portions other than said end portions thereof.
A method for manufacturing an active matrix substrate, comprising:
- a first step of forming a gate lead line upon a substrate;
- a second step of forming a gate insulation layer over said gate lead line;
- a third step of forming a semiconductor layer over said gate insulation layer;
- a fourth step of forming a source electrode and a drain electrode over said gate insulation layer;
- a fifth step of disposing an insulation material over said source electrode and said drain electrode;
- and
- a sixth step of forming a pixel electrode which is electrically connected to said drain electrode;
- wherein at least one of said first step, said fourth step, and said sixth step comprises the steps of:
- providing a liquid repelling layer in a region which surrounds a pattern formation region which has been set upon said active matrix substrate and in which a predetermined pattern is to be formed;
- and
- disposing liquid drops at end portions of said pattern formation region;
- and
- after having disposed said liquid drops at said end portions of said pattern formation region, disposing liquid drops in positions of said pattern formation region other than said end portions thereof.
Dependencies are inferred from the claim text.