Methods for compensating for a test temperature deviation
AssigneeMirae Corporation
InventorsJae Myeong Song, Chul Ho Ham, Chan Ho Park, Byeng Gi Lee
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AssigneeMirae Corporation
InventorsJae Myeong Song, Chul Ho Ham, Chan Ho Park, Byeng Gi Lee
Estimating the term…
Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature. The method includes fitting at least one semiconductor device to at least one test socket and starting a test, measuring in real time a temperature of the semiconductor device using a temperature sensor, detecting a measured temperature change rate and comparing the measured temperature change rate to a preset value, spraying cooling fluid onto the semiconductor device by controlling a cooling fluid supplying apparatus if the measured value change rate is higher than a preset value, and stopping spray of the cooling fluid onto the semiconductor device by controlling the cooling fluid supplying apparatus if the measured value change rate is below the preset value, thereby optimizing a test environment and improving yield.
A method for compensating for a test temperature deviation in a semiconductor device handler having a cooling fluid supplying apparatus, a nozzle assembly configured to spray cooling fluid supplied from the cooling fluid supplying apparatus onto at least one semiconductor device, respectively, fitted to at least one test socket, and a control unit configured to control the cooling fluid supplying apparatus, the method comprising:
A method for compensating for a test temperature deviation in a semiconductor device handler having a cooling fluid supplying apparatus, a nozzle assembly in communication with the cooling fluid supplying apparatus and configured to spray cooling fluid onto at least one semiconductor device, respectively, fitted to at least one test socket, and a control unit configured to control the cooling fluid supplying apparatus, the method comprising:
Dependencies are inferred from the claim text.