Method for forming image on object surface including circuit substrate
AssigneeDaiken Chemical Co., Ltd.
InventorsMasatoshi Kato, Akio Harada
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AssigneeDaiken Chemical Co., Ltd.
InventorsMasatoshi Kato, Akio Harada
Estimating the term…
By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (4). This photosensitive paste layer (4) is plotted by a laser beam (8) so as to form a plotted area (7). The photosensitive paste layer (4) is developed and an exposed area (4a) or an unexposed area (4b) is removed so as to form a circuit pattern (17). This circuit pattern (17) is sintered to form a circuit pattern (20) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet (2) is used as the substrate, it is possible to form a ceramic substrate (18) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.
A method for manufacturing a circuit substrate comprising the steps of:
A method for manufacturing multilayer circuit substrate comprises the steps of:
A method for forming an image on an object surface comprising the steps of:
Dependencies are inferred from the claim text.