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US 7,008,752 B2Granted
Photosensitive resin composition and use of the same
AssigneeNitto Denko Corporation
InventorsHirofumi Fujii, Yasuhito Funada, Satoshi Tanigawa
Life of this patent
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Abstract
A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.
Claims3
A photosensitive resin composition which comprises:
- (a) a poly(amic acid),
- (b) a 1,4-dihydropyridine derivative represented by the general formula (I):
- wherein R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1–4 carbon atoms;
- R3 and R4 each independently represent an alkyl or alkoxy group each having 1–4 carbon atoms;
- and R5 represents a hydrogen atom, an alkyl group having 1–4 carbon atoms, or a carboxyalkyl group in which the alkyl moiety has 1–4 carbon atoms, and
- (c) an imide acrylate compound represented by the general formula (II):
- wherein R1 represents a hydrogen atom or methyl and R represents a hydrocarbon group having 2 or more carbon atoms.
4 more elements
Dependencies are inferred from the claim text.