Sputtering device
AssigneeCYG Corporation
InventorNobuyuki Takahashi
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Abstract
An object of the invention is to provide a sputtering device which can provide increased distribution of film formation and coverage distribution better than prior sputtering devices. Thus, this invention is that, in the sputtering device constituted of a substrate holder for holding a substrate, at least one target for forming a thin film on the substrate, at least one sputtering cathode which has the target and magnets arranged behind the substrate, an axis of the target is inclined to an axis of the sputtering cathode, and the sputtering cathode is rotated on its axis to make the target swing relative to the substrate.
Claims21
A sputtering device constituted of a substrate holder for holding a substrate, at least one target for forming a thin film on the substrate, and at least one sputtering cathode in which said target is installed, wherein:
- an axis of said target is inclined to an axis of said sputtering cathode, and
- said sputtering cathode is rotated on its axis to make said target swing relative to said substrate holder.
Dependencies are inferred from the claim text.