Electrical joint forming member and plasma processing apparatus
AssigneesTokyo Electron Limited, Neomax Materials Co., Ltd.
InventorsToshihiro Hayami, Naoyuki Umehara, Tsuyoshi Hasegawa
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Abstract
An electrical joint forming member is held between adjacent conductive members included in a semiconductor device fabricating apparatus to reduce electrical resistance between those conductive members. The electrical joint forming member includes an elastic member made of a titanium sheet (75 μm thick, 2 mm wide) and having a surface covered with an aluminum layer (7 μm thick), the aluminum layer being formed by joining an aluminum sheet to the surface of the titanium sheet by cold-roll bonding.
Claims5
An electrical joint forming member to be held between adjacent conductive members included in a semiconductor device fabricating apparatus to reduce electrical resistance between those conductive members, said electrical joint forming member comprising:
- an elastic member made of a titanium sheet and having a surface covered with an aluminum layer, the aluminum layer being formed by joining an aluminum sheet to the surface of the titanium sheet by cold-roll bonding.
Dependencies are inferred from the claim text.