Communications adapter module
AssigneeIntel Corporation
InventorsThomas B. Mader, Dana L. Rose, Daehwan D. Kim
Life of this patent
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Abstract
An optical communications adapter module is provided which includes a XENPAK-sized casing and an XFP board assembly having an optical transmission connector and an optical reception connector where the XFP board assembly is positioned within the casing so the optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the casing. The module further includes a conversion board that is coupled to the XFP board where the conversion board is capable of communicating data between the XFP board assembly and a client computing device.
Claims15
An optical communications adapter module, comprising:
- a XENPAK-sized casing;
- an XFP board assembly having an optical transmission connector and an optical reception connector, the XFP board assembly being positioned within the casing so the optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the casing;
- and
- a conversion board being coupled to the XFP board, the conversion board configured to be capable of communicating data between the XFP board assembly and a client computing device.
An optical communications system, comprising:
- a client computing device including a microprocessor and a network processor coupled to one another;
- and
- an optical communications adapter module coupled to the client computing device, the optical communication adapter module including an XFP board assembly housed in a XENPAK-sized casing and a conversion board.
Dependencies are inferred from the claim text.