Contact bump construction for the production of a connector construction for substrate connecting surfaces

The contact bump construction for the formation of elevated contact sites on connecting surfaces of a substrate, particularly chip connecting surfaces, with a spacer body, whose at least partly electrically conductive surface is connected to the assigned connecting surface of the substrate through an electrical conductor, the spacer body (46, 49, 60, 70, 71, 72) being constructed from a dielectric, and the conductor being formed at least partly as a surface conductor (43, 65) arranged on the surface of the spacer body, characterized in that the spacer body (60) is arranged with a partial area (61) on a first partial surface (79) of the connecting surface (62) and also extends beyond the connecting surface, and the surface conductor (65) extends from a second partial area (80) of the connecting surface to an upper side (63) of the spacer body.