Multi-channel pressure sensing apparatus

Multi-channel pressure sensing apparatus comprising:

• an elongated base having opposed face surfaces and a plurality of sense element receiving bores formed between the opposed face surfaces, a plurality of guide holes and fixation bores formed in the base through one face surface,
• a sense element received in each sense element receiving bore, each sense element having opposite ends with a bore extending from an opening at one end to a closed head at the opposite end, the closed head having an outer diaphragm surface, a strain gauge mounted on the outer diaphragm surface adjacent said one face surface of the base,
• an electronic module assembly having an elongated, relatively rigid spacer/support member of electrically insulative material having upper and lower surfaces and having a plurality of pockets open to the upper and lower surfaces and to a side of the spacer, the spacer/support member having a first set of space apart guide posts extending upwardly from the spacer/support member and a second set of spaced apart guide posts extending downwardly from the spacer/support member, a relatively rigid, elongated contact printed circuit board (pcb) having circuit traces and having a guide hole formed therethrough for and alignable with each guide post of the first set, the contact pcb having opposed face surfaces with a plurality of contact pads on one face surface and a plurality of discrete electronic components mounted on the other face surface and positioned so that when the contact pcb is received on the upper face of the spacer/guide member with the guide posts received in respective guide holes, the discrete electronic components are received in the pockets formed in the spacer/support member, a relatively rigid, elongated sense element printed circuit board (pcb) having circuit traces and sense element wire bond pads and having a plurality of fixation holes formed therethrough and a guide hole formed therethrough and alignable with each guide post of the second set, the sense element pcb having opposed face surfaces with an opening therethrough for and alignable with each respective sense element and with the sense element wire bond pads on a first face surface for wire bond electrical connection with strain gauges of respective sense elements, the face surface of the sense element pcb on which the wire bond pads are disposed being received on the lower surface of the spacer with each guide post of the second set received through a respective guide hole of the sense element pcb and the sense element openings and sense element wire bond pads aligned with a pocket of the spacer;
• a flexible printed circuit board (pcb) having opposite end portions and a plurality of circuit traces, each end portion of the flexible pcb connected to a respective contact and sense element pcb with the circuit traces in electrical connection with circuit traces on the respective contact and sense element pcbs, the flexible pcb bent into a generally U-shaped configuration with the contact and sense element pcbs mounted on the spacer, the guide posts of the second set being received in respective guide holes in the said one face surface of the base and fasteners received through the fixation holes of the sense element pcb into the fixation bores of the base to rigidly attach the sense element pcb to the base and
• a cover received over the electronic module assembly onto the base and attached thereto, the cover having a shroud surrounded opening aligned with the contact pads of the contact pcb.