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US 7,007,380 B2Granted
TFI probe I/O wrap test method
AssigneeInternational Business Machines Corporation
InventorsGobinda Das, Franco Motika
Life of this patent
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Abstract
A method for testing external connections to semiconductor devices. The method includes providing an external electrical path between selected external connections on the semiconductor devices.
Claims5
A method for forming a structure for testing external connections to semiconductor devices, the method comprising:
- providing a thin film of electrically insulating material;
- providing a plurality of passages through the thin film of electrically insulating material, wherein the passages are arranged in a pattern corresponding to a pattern of external connections on the semiconductor device;
- providing electrically conducting material in the plurality of passages;
- and providing electrical connections between the electrically conducting material in selected passages.
1 more element
Dependencies are inferred from the claim text.