Process for manufacturing a printed wiring board
AssigneeInternational Business Machines Corporation
InventorsJohn G. Gaudiello, James D. Herard, John J. Konrad, Jeffrey McKeveny, Timothy L. Wells
Life of this patent
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Abstract
A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.
Claims5
A process for manufacturing a printed wiring board having a land grid array comprising the steps of:
- a) providing a personalized printed wiring board comprising copper circuitry and copper pads disposed on at least one lateral surface of said printed wiring board said copper pads comprising upper and sidewall surfaces, said personalized wiring board being absent a commoning structure;
- b) selectively covering said copper circuitry with a resist;
- c) using a non-electrolytic process, plating nickel onto said copper pad upper and sidewall surfaces;
- d) using a non-electrolytic process, plating a first precious metal onto said nickel;
- e) using a non-electrolytic process, plating a second, soft precious metal onto said first precious metal;
- and
- f) removing said resist, wherein at least one of said plated materials conformally covers upper and sidewall surfaces of said copper pad.
A process for manufacturing a printed wiring board having a land grid array comprising the steps of:
- a) providing a personalized printed wiring board comprising copper circuitry and copper pads disposed on at least one lateral surface of said printed wiring board said copper pads comprising upper and sidewall surfaces, said personalized wiring board being absent a commoning structure;
- b) selectively covering said copper circuitry with a resist;
- c) plating nickel onto said copper pad upper and sidewall surfaces;
- d) plating a first precious metal onto said nickel;
- e) plating a second precious metal comprising soft gold onto said first precious metal;
- and
- f) removing said resist, wherein at least one of said plated materials conformally covers said upper and sidewall surfaces of said copper pad.
Dependencies are inferred from the claim text.