Semiconductor integrated circuit device
AssigneesRenesas Technology Corp., Hitachi VLSI Engineering Corp.
InventorsKenichi Kuroda, Toshifumi Takeda, Hisahiro Moriuchi, Masaki Shirai, Jiroh Sakaguchi, Akinori Matsuo, Shoji Yoshida
Life of this patent
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Abstract
A nonvolatile storage element of a single-layer gate type structure is arranged so that a floating gate is formed of a conductive layer which partly overlaps with a control gate, formed of a diffused layer, and is provided with a barrier layer covering a part of or the whole surface of the floating gate. Nonvolatile storage elements characterized as such are used for redundancy control of defects or change of functions.
Claims7
A method of trimming a semiconductor integrated circuit device including an analog circuit, a nonvolatile storage element and a trimming circuit for trimming said analog circuit, comprising:
- a first trimming step including storing, in said nonvolatile storage element, a first trimming data of said analog circuit of said semiconductor integrated circuit device formed on a semiconductor wafer;
- a step of encapsulating said semiconductor integrated circuit device in a package;
- and
- after said encapsulating step, a second trimming step including storing, in said nonvolatile storage element, a second, different trimming data for performing fine trimming of said analog circuit,
- wherein, in said second trimming step, said storing of said second trimming data in said nonvolatile storage element is electrically performed.
A semiconductor integrated circuit device comprising:
- an analog circuit formed on a semiconductor substrate;
- a nonvolatile storage element formed on said semiconductor substrate;
- and
- a trimming circuit, formed on a semiconductor substrate, for trimming said analog circuit,
- wherein said semiconductor integrated circuit device is encapsulated in a package,
- said trimming circuit having a first trimming data, determined in said semiconductor integrated circuit device before said semiconductor integrated circuit device is encapsulated, for trimming said analog circuit and a second, different trimming data, determined after encapsulating said semiconductor integrated circuit device in said package, for performing a fine trimming of said analog circuit,
- said trimming circuit includes a nonvolatile storage element for storing said first trimming data and said second trimming data,
- wherein said second trimming data is electrically stored in said nonvolatile storage element by applying a voltage to an external terminal of said semiconductor integrated circuit device for changing states of said nonvolatile storage element.
Dependencies are inferred from the claim text.