US 7,002,809 B2Granted

Liquid crystal display driver integrated circuit package

AssigneeSamsung Electronics Co., Ltd.

InventorSung-Ho Lee

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Abstract

Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps and the signal input bumps have different surface areas that contact the mold and an adjacent conductive film. Due to the different contact surface areas, different amounts of pressure are applied to different parts on the conductive film when a force is applied to the mold. One or more bump pressure control patterns are formed on the mold compensate for the difference in pressure caused by this difference between the total contact areas. Accordingly, the LCD driver integrated circuit package can be mounted on a chip on glass type LCD panel without causing device failure.

Claims7

Dependent claims

An integrated circuit package for driving a liquid crystal display device, said integrated circuit package comprising:

a driving signal generating chip including image signal input pads for receiving an image signal from a data processing device, a driving signal generating module for generating a driving signal by processing the image signal, and driving signal output pads for outputting the driving signal;
a mold for enclosing the driving signal generating chip;
a first number of driving signal output bumps disposed in series on a first surface of the mold to be connected to the driving signal output pads;
a second number of image signal input bumps disposed in series on the first surface of the mold to be connected to the image signal input pads;
and
bump pressure controlling means formed on the first surface of the mold, wherein the bump pressure controlling means maintains a predetermined pressure deviations between a second pressure and a third pressure, the second pressure being applied onto the image signal input bumps by a first pressure applied onto a second surface of the mold opposite to the first surface, and a third pressure being applied onto the driving signal output bumps by the first pressure.

3 more elements

A chip-on-glass type liquid crystal display device comprising:

a liquid crystal display panel including driving signal input lines receiving a driving signal for controlling a liquid crystal and image signal input lines, in which the image signal input lines are spaced apart from the driving signal input lines and receive an image signal from a data processing device;
and
a liquid crystal display driver integrated circuit package including:
(a) a driving signal generating chip including image signal input pads for receiving an image signal from the data processing device, a driving signal generating module for generating a driving signal by processing the image signal, and driving signal output pads for outputting the driving signal;
(b) a mold for enclosing the driving signal generating chip;
(c) a first number of driving signal output bumps disposed in series on a first surface of the mold to connect the driving signal output pads to the driving signal input lines;
(d) a second number of image signal input bumps disposed in series on the first surface of the mold to connected the image signal input pads to the image signal input lines;
and
(e) an anisotropic conductive film, a first portion of the anisotropic conductive film interposed between the driving signal output bumps and the driving signal input lines, and a second portion of the anisotropic conductive film interposed between the image signal input pads and the image signal input lines;
and
(f) bump pressure controlling means formed on the first surface of the mold, wherein the bump pressure controlling means maintains a predetermined pressure deviations between a second pressure and a third pressure, the second pressure being transferred to the anisotropic conductive film through the image signal input bumps by a first pressure applied onto a second surface of the mold opposite to the first surface, and a third pressure being transferred to the anisotropic conductive film through the driving signal output bumps.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/427,411Filed 30 Apr 2003
Priority: KR 2002-002376830 Apr 2002
Published: US 2003/0202150 A130 Oct 2003
Granted: 21 Feb 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

G02F 1/13452
Conductors connecting electrodes to cell terminals: conductors connecting driver circuitry and terminals of panels
H10W 72/5449
Dispositions of bond wires: not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
H10W 72/926
Structures or relative sizes of bond pads: multiple bond pads having different sizes
H10W 72/932
Shapes of bond pads: plan-view shape, i.e. in top view