Electronic product with heat radiating plate
AssigneeNEC Compound Semiconductor Devices, Ltd.
InventorsToshimichi Kurihara, Takashi Ueda
Life of this patent
Estimating the term…
Abstract
An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame member securely associated with the heat radiating plate to encompass the electronic component, and a lid member securely attached to an upper opening end of the frame member, thereby accommodating and sealing the electronic component in the enveloper, and at least one electrically conductive element passing and extending through the frame member. The frame member is made of a suitable resin material, and the lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material.
Claims42
An electronic product comprising:
- a heat radiating plate;
- an electronic component securely mounted on said heat radiating plate;
- an enveloper including a frame member securely associated with said heat radiating plate to encompass said electronic component, and a lid member securely attached to an upper opening end of said frame member, thereby accommodating and sealing said electronic component in said enveloper;
- and
- at least one electrically conductive element passing and extending through said frame member,
- wherein said frame member is made of a suitable resin material, and said lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material;
- wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at least one perforation which is embedded in the molded frame member so as to be mechanically engaged with said molded frame member.
An electronic product comprising:
- a heat radiating plate;
- an electronic component securely mounted on said heat radiating plate;
- an enveloper including a frame member securely associated with said heat radiating plate to encompass said electronic component, and a lid member securely attached to an upper opening end of said frame member, thereby accommodating and sealing said electronic component in said enveloper;
- and
- at least one electrically conductive element passing and extending through said frame member,
- wherein said frame member is made of a suitable resin material, and at least a part of said lid member exhibits an electrical conductivity;
- and said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at least one perforation which is embedded in the molded frame member so as to be mechanically engaged with said molded frame member.
Dependencies are inferred from the claim text.