Clipping system and method for a single graphics semiconductor platform

A method for graphics processing, comprising:

• transforming graphics data from a first space to a second space;
• lighting the graphics data;
• performing a clipping operation on the graphics data;
• setting up the graphics data;
• and
• rendering the graphics data;
• wherein the graphics data is set up, transformed, lighted, and rendered, and the clipping operation is performed, on a single semiconductor platform.

A single-platform graphics pipeline system with an integrated clipping operation, comprising:

• a transform module positioned on a single semiconductor platform for transforming graphics data;
• a lighting module positioned on the same single semiconductor platform as the transform module, the lighting module being for performing lighting operations on the graphics data;
• a set-up module positioned on the same single semiconductor platform as the transform module and the lighting module, the set-up module being for setting up the graphics data;
• and
• a rendering module positioned on the same single semiconductor platform as the transform module, the lighting module, and the set-up module, the rendering module being for 3-D rendering of the graphics data;
• wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom;
• wherein a clipping operation is performed utilizing the single semiconductor platform;
• wherein the single semiconductor platform also operates with an open application program interface.

A method for graphics processing, comprising:

• transforming graphics data from a first space to a second space;
• lighting the graphics data;
• performing a clipping operation on the graphics data;
• selling up the graphics data;
• and
• 3-D rendering the graphics data;
• wherein the graphics data is set up, transformed, lighted, and rendered, and the clipping operation is performed, on a single semiconductor platform;
• wherein the single semiconductor platform also operates with an open application program interface.

A single-platform graphics pipeline system with an integrated clipping operation, comprising:

• a transform module positioned on a single semiconductor platform for transforming graphics data;
• a lighting module positioned on the same single semiconductor platform as the transform module, the lighting module being for performing lighting operations on the graphics data;
• a set-up module positioned on the same single semiconductor platform as the transform module and the lighting module, the set-up module being for setting up the graphics data;
• a rendering module positioned on the same single semiconductor platform as the transform module, the lighting module, and the set-up module, the rendering module being for 3-D rendering of the graphics data;
• and
• memory positioned on the same single semiconductor platform as the transform module, the lighting module, the set-up module, and the render module for storing the graphics data;
• wherein a clipping operation is performed utilizing the single semiconductor platform;
• wherein the graphics data is blended utilizing the single semiconductor platform for blending triangles represented by vertex data associated with the graphics data;
• wherein a vertex fog operation is performed on the graphics data utilizing the single semiconductor platform;
• wherein the single semiconductor platform operates with a Direct3D application program interface;
• wherein the single semiconductor platform also operates with an OpenGL application program interface;
• wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom.