Coil component
AssigneeTDK Corporation
InventorsTomokazu Ito, Takashi Kudo, Makoto Otomo
Life of this patent
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AssigneeTDK Corporation
InventorsTomokazu Ito, Takashi Kudo, Makoto Otomo
Estimating the term…
The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N−1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.
A coil component comprising:
Dependencies are inferred from the claim text.