Semiconductor device for reducing the number of probing pad used during wafer test and method for testing the same
AssigneeHynix Semiconductor Inc.
InventorsTae Jin Kang, Woon Bok Lee
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Abstract
The present invention relates to a semiconductor device and a method for testing the same capable of reducing the number of probing pads used during wafer test. The semiconductor device includes a select circuit connected between a plurality of internal circuits to be tested and a single probing pad, for transmitting test signals inputted from the probing pads to any one of the plurality of the internal circuits according to a test mode signal generated in a wafer test mode. It is possible to reduce the number of the probing pads in the integrated circuit used for connection to a probe for contact of a probe card during wafer test. It is therefore possible to reduce test time.
Claims53
A semiconductor device, comprising:
- an internal circuit block provided on a die, each internal circuit block having a plurality of internal circuits;
- and
- a select circuit unit also disposed on the die for selectively transmitting test signals inputted through a pad to any one of the internal circuits of the internal circuit block according to test mode signals generated during a wafer test, the select circuit unit including a plurality of select circuits.
A method of testing a wafer, comprising the steps of:
- dividing an integrated circuit formed on a die into an internal circuit block and a select circuit unit;
- selectively transmitting test signals inputted through a probing pad through a select circuit of the select circuit unit and to an internal circuit of the internal circuit block according to a test mode signal generated during wafer test;
- and
- testing the operation of the corresponding internal circuit operated according to the transmitted test signal through the probing pads, by monitoring it.
Dependencies are inferred from the claim text.