System and method for measuring the thickness or temperature of a circuit in a printed circuit board
AssigneeBroadcom Corporation
InventorJames M. Kronrod
Life of this patent
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AssigneeBroadcom Corporation
InventorJames M. Kronrod
Estimating the term…
System for measuring a thickness of a circuit component on a printed circuit board (PCB). The system includes a first circuit, a power plane, a power strip, a calibration strip, a temperature sensor, and a second circuit. The power plane is coupled to the first circuit. The power strip is for providing power to the power plane and is disposed in the PCB connected to the power plane. The power strip has at least two vias. The calibration strip has a predetermined width and is disposed in said PCB. The calibration strip has at least two vias for measuring a voltage drop. The temperature sensor is coupled to the calibration strip and configured to measuring a temperature of the calibration strip. The second circuit is coupled to the temperature sensor and configured to determine the thickness of the calibration strip based on at least the temperature of the calibration strip.
A system for measuring a thickness of a circuit component on a printed circuit board (PCB), said system comprising:
A system for measuring a thickness of circuit components on a printed circuit board (PCB), said system comprising:
A method for determining a thickness of a power strip of a circuit on a printed circuit board (PCB), said method comprising the steps of:
A method for determining a thickness of a component of a circuit on a printed circuit board (PCB), said method comprising the steps of:
A system for measuring a thickness of a circuit component on a printed circuit board (PCB), said system comprising:
A system for measuring a thickness of circuit components on a printed circuit board (PCB), said system comprising:
Dependencies are inferred from the claim text.