Optical component package and packaging including an optical component horizontally attached to a substrate

An optical component package, comprising:

• a substrate;
• an optical component disposed on the substrate, wherein one surface of the optical component located away from the substrate receives an optical signal;
• a plurality of spacers, which are disposed between the substrate and the optical component;
• a plurality of wires electrically connecting the optical component to the substrate;
• a dam encompassing the optical component;
• and
• a transparent lid, which provided on the dam, wherein a diameter of each of the spacers is equal to a distance between a surface of the transparent lid and a surface of the substrate minus a thickness of the optical component minus a distance between where the optical signal enters the transparent lid and where the optical signal is received by the optical component.

An optical component package, comprising:

• a substrate;
• a semiconductor component disposed on the substrate;
• a plurality of first wires electrically connecting the semiconductor component to the substrate;
• an optical component disposed on the semiconductor component, wherein one surface of the optical component located away from the semiconductor component receives an optical signal;
• a plurality of spacers, which are disposed between the semiconductor component and the optical component;
• a plurality of second wires electrically connecting the optical component to the substrate;
• and
• a transparent molding compound encapsulating the semiconductor component and the optical component, where a diameter of each of the spacers is equal to a thickness of the transparent molding compound minus a thickness of the optical component minus a distance between where the optical signal enters the transparent molding compound and where the optical signal is received by the optical component minus a thickness of the semiconductor component.

An optical component package, comprising:

• a substrate;
• a semiconductor component disposed on the substrate;
• a plurality of first wires electrically connecting the semiconductor component to the substrate;
• an optical component disposed on the semiconductor component, wherein one surface of the optical component located away from the semiconductor component receives an optical signal;
• a plurality of spacers, which are disposed between the semiconductor component and the optical component;
• a plurality of second wires electrically connecting the optical component to the substrate;
• a dam encompassing the optical component;
• and
• a transparent lid, which is provided on the dam, wherein a diameter of each of the spacers is equal to a distance between a surface of the transparent lid and a surface of the substrate minus a thickness of the optical component minus the distance between where the optical signal enters the transparent lid and where the optical signal is received by the optical component minus a thickness of the semiconductor component.