Semiconductor components having multiple on board capacitors
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Mike Brooks
Life of this patent
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Abstract
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the die. The capacitor includes a first electrode in electrical communication with a first terminal contact for the component, and a second electrode in electrical communication with a second terminal contact for the component. The electrodes are separated by a dielectric layer and protected by an outer protective layer of the component. The capacitor can be fabricated using redistribution layers on a wafer containing multiple dice. The component can be used to construct systems such as multi chip packages and multi chip modules.
Claims36
A semiconductor component comprising:
- a semiconductor die comprising a plurality of die contacts;
- at least one redistribution layer on the die configured to redistribute a pattern of the die contacts;
- and
- a plurality of on board capacitors on the die, each capacitor comprising a first electrode comprising a portion of a first redistribution layer, a second electrode comprising a portion of a second redistribution layer, and a dielectric layer separating the first electrode and the second electrode.
A semiconductor component comprising:
- a semiconductor die comprising a plurality of die contacts, the die contained on a semiconductor wafer comprising a plurality of dice identical to the die;
- at least one redistribution layer on the die configured to redistribute a pattern of the die contacts;
- and
- a plurality of on board capacitors on the die, each capacitor comprising a portion of the at least one redistribution layer.
A semiconductor component comprising:
- a semiconductor die comprising a first redistribution layer and a second redistribution layer;
- and
- a plurality of capacitors on the die, each capacitor comprising a first electrode comprising a portion of the first redistribution layer, a second electrode comprising a portion of the second redistribution layer, and a dielectric layer separating the first electrode and the second electrode.
A semiconductor component comprising:
- a semiconductor die comprising a first redistribution layer and a second redistribution layer;
- a plurality of capacitors on the die comprising portions of the first redistribution layer and portions of the second redistribution layer;
- and
- a plurality of integrated circuits and die contacts on the die in electrical communication with the capacitors.
A semiconductor component comprising:
- a semiconductor die comprising a first redistribution layer and a second redistribution layer;
- a plurality of capacitors on the die comprising portions of the first redistribution layer and portions of the second redistribution layer;
- and
- a plurality of terminal contacts on the die in electrical communication with the capacitors.
A semiconductor component comprising:
- a semiconductor die comprising a first redistribution layer and a second redistribution layer;
- a plurality of capacitors on the die comprising portions of the first redistribution layer and portions of the second redistribution layer;
- and
- a protective layer on the die encapsulating the capacitors.
A semiconductor component comprising:
- a semiconductor die;
- a first redistribution layer on the die and a second redistribution layer on the die;
- and
- a plurality of on board capacitors on the die, each capacitor comprising a first electrode comprising a portion of the first redistribution layer, a dielectric layer on the first electrode, and a second electrode on the dielectric layer comprising a portion of the second redistribution layer.
A semiconductor component comprising:
- a semiconductor die having a peripheral outline;
- a first redistribution layer on the die and a second redistribution layer on the die;
- and
- at least one on board capacitor on the die comprising a first electrode comprising a portion of the first redistribution layer, a dielectric layer on the first electrode, and a second electrode on the dielectric layer comprising a portion of the second redistribution layer;
- the first electrode and the second electrode having peripheral outlines corresponding to but slightly smaller than the peripheral outline of the die.
A semiconductor component comprising:
- a semiconductor die;
- a capacitor having a peripheral outline and comprising a first electrode comprising a portion of a first redistribution layer on the die, and a second electrode comprising a portion of a second redistribution layer on the die;
- and
- a plurality of terminal contacts on the die located within the peripheral outline.
A semiconductor component comprising:
- a semiconductor die comprising a plurality of die contacts;
- at least one capacitor on the die comprising a first pair of electrodes in electrical communication with a first die contact, a dielectric layer on the first pair of electrodes, and a second pair of electrodes on the dielectric layer in electrical communication with a second die contact;
- and
- a first terminal contact on the die in electrical communication with the first pair of electrodes, and a second terminal contact on the die in electrical communication with the second pair of electrodes.
Dependencies are inferred from the claim text.