Chip package structure with dual heat sinks
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsMing-Lun Ho, Yu-Wen Chen
Life of this patent
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Abstract
A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink. The active surface of the chip is attached on the upper surface of the substrate via bumps, so that the chip electrically connects to the substrate. The stiffener is disposed on the upper surface of the substrate and around the chip. The first heat sink is disposed on the back surface of the chip and on the stiffener ring. The second heat sink is disposed on the lower surface of the substrate.
Claims9
A chip package structure, comprising:
- a substrate, having an upper surface and a lower surface;
- a chip, having an active surface and a back surface, wherein the active surface of the chip is mounted to the upper surface of the substrate, and the chip is electrically connected to the substrate;
- a stiffener, disposed on the upper surface of the substrate and around the chip;
- a first heat sink, disposed on the back surface of the chip and on the stiffener;
- and
- a second heat sink, disposed on the lower surface of the substrate and below the chip, wherein a coefficient of thermal expansion of the second heat sink is the same as that of the substrate.
Dependencies are inferred from the claim text.