Apparatus and method for repairing resist latent images
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorBurn J. Lin
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Abstract
A method and an apparatus for repairing resist latent image on a wafer are disclosed. In the method, an image scanner equipped with a first and a second wafer carrier, and a primary imaging column and a secondary imaging column is utilized to conduct the processes of imaging a resist latent image on a first wafer and repairing a defect in a resist latent image on a second wafer positioned on a second wafer carrier simultaneously. The primary imaging column and the secondary imaging column may be situated in the same vacuum chamber to facilitate operation.
Claims11
A method for repairing resist latent image on a wafer comprising the steps of:
- providing an image scanner equipped with a wafer carrier;
- positioning a wafer on said wafer carrier situated under a primary imaging column;
- imaging a resist latent image on said wafer after measuring alignment and focus on said wafer;
- storing a predetermined defect location in a process controller;
- moving said wafer on said wafer carrier to under a supplemental imaging column;
- and
- irradiating an energy beam on said defect and repairing said resist latent image in a supplemental exposure step.
Dependencies are inferred from the claim text.