Multilayer wiring board
AssigneeFujitsu Limited
InventorsMotoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Takashi Shuto
Life of this patent
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Abstract
A multilayer wiring board is composed of a core portion, a first wiring portion and a second wiring portion. The core portion includes a core insulating layer containing a carbon fiber material. The first wiring portion is bonded to the core portion and has a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth. The second wiring portion is bonded to the first wiring portion and has a laminated structure including at least a second insulating layer and a second wiring pattern. The core portion, the first wiring portion and the second wiring portion are arranged in a stack.
Claims9
A multilayer wiring board comprising:
- a core portion including a core insulating layer containing a carbon fiber material;
- a first lamination wiring portion bonded to the core portion and having a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth;
- and
- a second lamination wiring portion bonded to the first lamination wiring portion and having a laminated structure including at least a second insulating layer and a second wiring pattern;
- wherein the core portion, the first lamination wiring portion and the second lamination wiring portion are arranged in a stack;
- and
- wherein the core insulating layer, the first insulating layer and the second insulating layer have respective thermal expansion coefficients defined in a surface-spreading direction transverse to a stacking direction of these three layers, the thermal expansion coefficient of the core insulating layer being smallest among said three layers, the thermal expansion coefficient of the second insulating layer being largest among said three layers, the thermal expansion coefficient of the first insulating layer being larger than that of the core layer but smaller than that of the second insulating layer.
A multilayer wiring board comprising:
- a core portion including a core insulating layer containing a carbon fiber material;
- two first lamination wiring portions respectively bonded to opposite sides of the core portion, each of the first lamination wiring portions having a laminated structure including at least a first insulating layer and a first wiring pattern, the first insulating layer containing glass cloth;
- and
- a second lamination wiring portion bonded to one of the first lamination wiring portions and having a laminated structure including at least a second insulating layer and a second wiring pattern;
- wherein the core portion, the first lamination wiring portions and the second lamination wiring portion are arranged in a stack;
- and
- wherein the core insulating layer, the first insulating layer and the second insulating layer have respective thermal expansion coefficients defined in a surface-spreading direction transverse to a stacking direction of these three layers, the thermal expansion coefficient of the core insulating layer being smallest among said three layers, the thermal expansion coefficient of the second insulating layer being largest among said three layers, the thermal expansion coefficient of the first insulating layer being larger than that of the core layer but smaller than that of the second insulating layer.
Dependencies are inferred from the claim text.