Acrylic resin formulations curable to clear, heat-resistant bodies

A non-aqueous, solvent free formulation, curable by actinic radiation to a clear, heat-resistant solid body, consisting essentially of:

• about 10 to 40 percent of a nonpolymerizable acrylic resin having an inherent acid value of at least about 20 mg KOH/g and a molecular weight less than about 80,000;
• 90 to 45 percent of at least one polymerizable reactive diluent, in which said acrylic resin is substantially completely dissolved, selected from the group of compounds consisting of tetrahydrofuryl (meth)acrylate, N,N-dimethyl acrylamide, 2-hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, and alkoxylated counterparts to the aforesaid compounds;
• an amount of a free-radical photoinitiator sufficient for effecting polymerization of said reactive diluent;
• zero to about 5 percent of at least one adhesion promoter;
• zero to about 30 percent of at least one crosslinking agent;
• zero to about 2 percent of at least one thickener;
• and zero to about 4 percent of at least one stabilizer, all based upon the weight of said formulation.

In a method for the production of a clear, transparent, heat-resistant solid body, the steps comprising:

• providing a non-aqueous, solvent-free formulation, curable by actinic radiation to a clear, heat-resistant solid body, consisting essentially of:
• about 10 to 40 percent of a nonpolymerizable acrylic resin having substantial inherent acidity;
• 90 to 45 percent of at least one polymerizable reactive diluent, in which said acrylic resin is substantially completely dissolved, selected from the group of compounds consisting of tetrahydrofuryl (meth)acrylate, N,N-dimethyl acrylamide and carbon and nitrogen-substituted analogs thereof, 2-hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypropyl (meth)acrylate, and alkoxylated counterparts to the aforesaid compounds;
• an amount of a free-radical photoinitiator sufficient for effecting polymerization of said reactive diluent;
• zero to about 5 percent of at least one adhesion promoter;
• zero to about 30 percent of at least one cross-linking agent;
• zero to about 2 percent of at least one thickener;
• and zero to about 4 percent of at least one stabilizer, all based upon the weight of said formulation;
• forming a deposit of a quantity of said formulation;
• and
• exposing said deposit to actinic radiation for effecting polymerization of said reactive diluent, and thereby to produce said solid body.

In a method for the production of an optoelectronic device, the steps comprising:

• providing at least one light-emitting element on a substrate;
• providing a non-aqueous, solvent-free formulation, curable by actinic radiation to a clear, heat-resistant solid body, consisting essentially of:
• about 10 to 40 percent of a nonpolymerizable acrylic resin having substantial inherent acidity;
• 90 to 45 percent of at least one polymerizable reactive diluent, in which said acrylic resin is substantially completely dissolved, selected from the group of compounds consisting of tetrahydrofuryl (meth)acrylate, N,N-dimethyl acrylamide and carbon and nitrogen-substituted analogs thereof, 2-hydroxyethyl (methyl)acrylate hydroxybutyl (meth)acrylate, hydroxypropyl (meth)acrylate, and alkoxylated counterparts to the aforesaid compounds;
• an amount of a free-radical photoinitiator sufficient for effecting polymerization of said reactive diluent;
• zero to about 5 percent of at least one adhesion promoter;
• zero to about 30 percent of at least one cross-linking agent;
• zero to about 2 percent of at least one thickener;
• and zero to about 4 percent of at least one stabilizer, all based upon the weight of said formulation;
• exposing said deposit to actinic radiation for effecting curing of said deposit, and thereby to produce a solid body;
• and
• prior or subsequent to said exposing step, applying said quantity of said formulation to said substrate in overlying relationship to said light-emitting element.