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US 7,001,874 B2Granted
Non-corrosive cleaning composition for removing plasma etching residues
AssigneeArch Specialty Chemicals, Inc.
InventorsKenji Honda, Michelle Elderkin, Vincent Leon
Life of this patent
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Abstract
A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.
Claims11
A cleaning composition useful for removing plasma etch residues formed on a substrate which comprises:
- (a) water;
- (b) at least one hydroxylammonium compound;
- (c) at least one basic compound other than hydroxylamine;
- and
- (d) at least one organic carboxylic acid consisting of carbon, hydrogen, and oxygen atoms, present in an amount between about 0.01 wt. % to 10 wt. % based on the total weight of the composition, wherein said composition is free of fluorine-containing compound.
2 more elements
Dependencies are inferred from the claim text.