US 7,001,799 B1 · Method of making a leadframe for semiconductor devices

Abstract

A semiconductor package comprising a leadframe which includes a die paddle having an opening formed therein. In addition to the die paddle, the leadframe includes a plurality of leads, at least one of which is disposed in spaced relation to the die paddle. The remaining leads are attached to the die paddle and extend therefrom. Electrically connected to the die paddle is the source terminal of a semiconductor die which also includes a gate terminal and a drain terminal. The gate terminal is itself electrically connected to the at least one of the leads disposed in spaced relation to the die paddle. A package body at least partially encapsulates the die paddle, the leads, and the semiconductor die such that portions of the leads and the drain terminal of the semiconductor die are exposed in the package body.

Claims22

Dependent claims

A method of fabricating a semiconductor package, comprising the steps of:

a) providing a leadframe which includes at least two leads and a die paddle having an opening formed therein, one of the leads being disposed in spaced relation to the die paddle, with the remaining one of the leads being attached to the die paddle;
b) providing at least one semiconductor die having a source terminal, a gate terminal and a drain terminal;
c) electrically connecting the source terminal to the die paddle and the gate terminal to the at least one of the leads disposed in spaced relation to the die paddle;
and
d) at least partially encapsulating the die paddle, the leads and the semiconductor die with a package body such that at least portions of the leads and the drain terminal of the semiconductor die are exposed in the package body.

2 more elements

Dependencies are inferred from the claim text.

Method of making a leadframe for semiconductor devices

Life of this patent

Method of making a leadframe for semiconductor devices

Life of this patent

Abstract

Claims22