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US 7,001,797 B2Granted
Optical device and method of manufacturing the same, optical module, circuit board, and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A plurality of covers each of which has a light transmitting section are attached to a substrate on which is formed a plurality of optical elements each of which has an optical section, and each of the optical sections is sealed by each of the covers. Then, the substrate is cut into individual ones of the optical elements.
Claims16
A method of manufacturing an optical device comprising:
- (a) attaching a plurality of covers each of which has a light transmitting section to a substrate on which is formed a plurality of optical elements each of which has an optical section, in a single operation in a state in which the covers are relatively fixed, and sealing each of the optical sections by each of the covers, the covers connected by connecting sections so that the covers are relatively fixed;
- and
- (b) cutting the connecting sections by a first cutter and cutting the substrate by a second cutter into individual ones of the optical elements.
Dependencies are inferred from the claim text.