Method of making layered superlattice material with improved microstructure

A method of fabricating an integrated circuit comprising:

• providing a substrate, a first precursor containing metal moieties in effective amounts for spontaneously forming a first thin film layered superlattice material upon heating said first precursor, and a second precursor containing metal moieties in effective amounts for spontaneously forming a second thin film layered superlattice material upon heating said second precursor, said first precursor being different than said second precursor;
• applying said first precursor to said substrate to form a first coating, and thereafter applying said second precursor to said substrate to form a second coating;
• treating said coatings on said substrate to form on said substrate said first thin film of layered superlattice material having a first thickness and said second thin film layered superlattice material having a second thickness, wherein the ratio of said second thickness to said first thickness ranges from 5% to 35%;
• and
• completing the fabrication of said integrated circuit to include at least a portion of said first and second thin film layered superlattice materials in said integrated circuit.

A method of fabricating an integrated circuit comprising:

• providing a substrate, a precursor containing metal moieties in effective amounts for spontaneously forming a layered superlattice material upon heating said precursor;
• applying said precursor to said substrate to form a coating;
• performing a first rapid thermal processing of said coating to form a solid thin film on said substrate;
• forming an electrode on said solid thin film;
• patterning said electrode and said solid thin film;
• performing a second rapid thermal processing of said patterned electrode and said solid film to form said layered superlattice material;
• and
• completing the fabrication of said integrated circuit to include at least a portion of said layered superlattice material in an active element of said integrated circuit.

A method of fabricating an integrated circuit comprising:

• providing a substrate, a precursor containing metal moieties in effective amounts for spontaneously forming a layered superlattice material upon heating said precursor;
• applying said precursor to said substrate to form a coating;
• and
• treating said coating to form a solid film, said treating comprising applying ultraviolet radiation having an energy density between 83 mJ/cm2 and 100 mJ/cm2.