Molding resin composition and method of molding
AssigneeCluster Technology Co., Ltd.
InventorsMinoru Adachi, Shoji Uesugi
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Abstract
The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 μm or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 μm, is integrally molded.
Claims6
A method for producing an ink ejecting apparatus comprising:
- introducing a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of an organic filler having a particle size of 10 μm or less and having a thermal expansion coefficient of 2 to 7×10−5 and a solidification contraction ratio of 0.8% or less to a mold of a nozzle chamber plate;
- heating the mold so as to mold a nozzle chamber plate in which a nozzle having a hole size of 500 μm or less can be formed;
- molding a vibration plate with a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of an organic filler having a particle size of 10 μm or less and having a thermal expansion coefficient of 2 to 7×10−5 and a solidification contraction ratio of 0.8% or less;
- and
- molding integrally the obtained nozzle chamber plate and the obtained vibration plate, to form the inkjet ejecting apparatus.
Dependencies are inferred from the claim text.