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AssigneeTDK Corporation
InventorsKazuhiko Oda, Tetuji Maruno, Kouji Tanaka, Akira Sasaki
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A composite substance for forming a conductive paste, comprises a solvent being compatible with an organic component included in the conductive paste, and metal particles wetted by the solvent. The conductive paste comprises an organic binder, the composite substance and an organic solvent mixed with the organic binder and the composite substance. The method for manufacturing the composite substance comprises the step of adding the solvent to undried metal particles having been washed with water, the solvent being compatible with the organic binder included in the conductive paste and incompatible with water so that the water is replaced by the solvent. The method for manufacturing the conductive paste comprises the step of mixing an organic binder and an organic solvent with the composite substance.
Particles for a conductive paste, each of said particles comprising a metal particle and a solvent, wherein said metal particle is wetted by said solvent, and said solvent is compatible with an organic component and insoluble in water,
Particles for a conductive paste, each of said particles comprising a metal-compound particle and a solvent, wherein said metal-compound particle is wetted by said solvent, and said solvent is compatible with an organic component and insoluble in water,
A conductive paste prepared from particles, wherein:
A conductive paste prepared from particles, wherein:
Dependencies are inferred from the claim text.