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US 7,001,260 B2Granted
Carrier head with a compressible film
AssigneeApplied Materials, Inc.
InventorsHung Chih Chen, Steven M. Zuniga
Life of this patent
Estimating the term…
Abstract
A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.
Claims14
An article for use in a carrier head, comprising:
- a compressible film that is detachably securable to a surface of a rigid structure in the carrier head, the compressible film having a first plurality of apertures of a first size and a second plurality of apertures of a second size, the first size being different from the second size, the first and second pluralities of apertures are positioned so that downward pressure on the film is distributed by contact to create a non-uniform pressure distribution on a substrate during polishing of the substrate so as to improve polishing uniformity.
A kit comprising:
- a plurality of compressible films detachably securable to a bottom surface of a rigid structure, each compressible film having a first plurality of apertures of a first size and a second plurality of apertures of a second size, the first size being different from the second size, where the first and second pluralities of apertures are positioned so that downward pressure on the film is distributed by contact to create a non-uniform pressure distribution on a substrate during polishing of the substrate, wherein at least two of the compressible films have apertures disposed in different patterns to create different pressure distributions on the substrate.
Dependencies are inferred from the claim text.