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US 7,001,253 B2Granted
Boron-containing polishing system and method
AssigneeCabot Microelectronics Corporation
InventorsRenjie Zhou, Steven K. Grumbine, Issac K. Cherian
Life of this patent
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Abstract
The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.
Claims16
A chemical-mechanical polishing system comprising:
- (a) an abrasive and/or polishing pad,
- (b) boric acid, or a conjugate base thereof, and
- (c) an aqueous carrier,
- wherein the boric acid or conjugate base thereof is not present in the polishing system in a sufficient amount to act as a pH buffer.
1 more element
A method of polishing a substrate comprising:
- (i) contacting a substrate with a chemical-mechanical polishing system comprising;
- (a) an abrasive and/or polishing pad,
- (b) boric acid, or conjugate base thereof, and
- (c) an aqueous carrier,
- wherein the boric acid or conjugate base thereof is not present in the polishing system in a sufficient amount to act as a pH buffer, and
- (ii) abrading at least a portion of the substrate to polish the substrate.
3 more elements
Dependencies are inferred from the claim text.