Back to results
US 7,001,246 B2Granted
Method and apparatus for monitoring a metal layer during chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsHiroji Hanawa, Nils Johansson, Boguslaw Swedek, Manoocher Birang
Life of this patent
Estimating the term…
Abstract
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
Claims18
A polishing system, comprising:
- a polishing pad having a polishing surface, a bottom surface, a cover layer, and a backing layer, the polishing pad including a recess formed in the bottom surface, wherein the recess includes an aperture formed in the backing layer, and wherein the recess includes an indentation formed in a bottom surface of cover layer and aligned with the aperture in the backing layer;
- a carrier operable to hold a substrate against the polishing surface of the polishing pad;
- a motor operable to cause relative motion between the polishing pad and the substrate;
- and
- an eddy current monitoring system including a ferromagnetic body positioned on a side of the polishing surface opposite the substrate, the ferromagnetic body extending into the recess and at least partially through the polishing pad, the eddy current monitoring system being operable to monitor a magnetic field using an induction coil that is magnetically coupled to the ferromagnetic body.
2 more elements
A method of polishing, comprising:
- bringing a substrate into contact with a polishing surface of a polishing pad that includes a recess formed in a bottom surface thereof, a cover layer, and a backing layer, wherein the recess includes an aperture formed in the backing layer, and wherein the recess includes an indentation formed in a bottom surface of cover layer and aligned with the aperture in the backing layer;
- positioning a ferromagnetic body on a side of the polishing surface opposite the substrate so that the ferromagnetic body extends into the recess and at least partially through the polishing pad;
- causing relative motion between the substrate and the polishing pad;
- and
- monitoring a magnetic field using an induction coil that is magnetically coupled to the ferromagnetic body.
2 more elements
Dependencies are inferred from the claim text.