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US 7,001,245 B2Granted
Substrate carrier with a textured membrane
AssigneeApplied Materials, Inc.
InventorHung Chih Chen
Life of this patent
Estimating the term…
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a membrane with an exterior grooved surface for improved chemical mechanical polishing. The exterior grooved surface provides a path for the flow of air from the portion between the membrane and a substrate.
Claims26
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a chamber within the carrier head, the mounting surface including a textured inner portion and a peripheral portion surrounding the textured inner portion, the peripheral portion including a textured portion adjacent the textured inner portion, a smooth portion surrounding the textured portion, the textured inner portion comprising texture that permits air flow along an outer surface of the membrane while the outer surface contacts the substrate, the membrane configured such that the peripheral portion contacts the substrate when the chamber is evacuated and does not contact the substrate when the chamber is pressurized;
- and
- evacuating the chamber to form a seal between the smooth portion of the peripheral portion and the substrate.
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a pressurizable chamber within the carrier head, the mounting surface including a grooved inner portion and an outer portion surrounding the grooved inner portion, the outer portion including a grooved portion and a smooth portion surrounding the grooved portion, the grooved inner portion comprising grooves that permits air flow along an outer surface of the membrane while the outer surface contacts the substrate, the membrane configured such that the outer portion contacts the substrate when the chamber is evacuated and does not contact the substrate when the chamber is pressurized;
- placing the substrate against a polishing surface;
- and
- pressurizing the chamber to inflate the membrane with a first pressure.
1 more element
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a chamber within the carrier head, the mounting surface including a grooved inward portion and a peripheral portion, the peripheral portion including a grooved portion and a smooth portion surrounding the grooved portion, the grooved inward portion comprising grooves that permits air flow along the outer surface of die membrane while the outer surface contacts a substrate, the membrane configured such that the peripheral portion contacts a substrate when the chamber is evacuated and does not contact the substrate when the chamber is pressurized;
- polishing the substrate;
- evacuating the chamber to form a seal between the smooth portion of the peripheral portion and the substrate after polishing of the substrate;
- transferring the substrate from a polishing pad to an unloading station;
- and
- pressurizing the chamber to inflate the membrane to break the seal between the substrate and the smooth portion of the peripheral portion to position the substrate onto the unloading station.
3 more elements
A method of releasing air from a region formed by contact between a substrate and a flexible membrane defining a chamber, comprising:
- evacuating the chamber to form a seal between the substrate and the flexible membrane;
- and
- pressurizing the chamber to break the seal between the substrate and the flexible membrane so that a lip of the flexible membrane separates from the substrate and exposes one or more channels formed on an outer surface of the membrane.
A carrier head for chemical mechanical polishing a substrate, comprising:
- a base;
- and
- a flexible membrane extending beneath the base to define a pressurizable chamber, an outer surface of the flexible membrane providing a mounting surface for the substrate, the outer surface including a textured portion and a smooth portion surrounding the textured portion, the mounting surface of the membrane having a central region surrounded by an outer region, the textured portion comprising texture that permits air flow along the outer surface of the membrane while the outer surface contacts the substrate, the outer region including the smooth portion and at least part of the textured portion, wherein the membrane is configured such that the outer region contacts the substrate when the chamber is evacuated and does not contact the substrate when the chamber is pressurized.
A chemical mechanical polishing apparatus, comprising:
- a rotatable polishing pad;
- and
- a carrier head including a base and a flexible membrane extending beneath the base to define a pressurizable chamber, a lower surface of the flexible membrane providing a mounting surface for a substrate, the mounting surface including a textured portion and a smooth portion surrounding the textured portion, the textured portion comprising texture that permits air flow along an outer surface of the membrane while the outer surface contacts the substrate, the mounting surface of the membrane having a central region surrounded by an outer region, the outer region including the smooth portion and at least part of the textured portion, wherein the membrane is configured such that the outer region contacts the substrate when the chamber is evacuated and does not contact the substrate when the chamber is pressurized.
A membrane for a carrier head, comprising:
- an impermeable flexible and elastic membrane having an outer surface, the outer surface including a textured inner portion and an outer portion surrounding the textured inner portion, the outer portion including a smooth portion and a textured portion, the textured inner portion comprising texture that permits air flow along the outer surface of the membrane while the outer surface contacts a substrate, the membrane configured such that the outer portion contacts the substrate when a chamber bounded at least in part by the membrane is evacuated and does not contact the substrate when the chamber is pressurized.
Dependencies are inferred from the claim text.